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ISSN: 2375-3897

American Journal of Energy and Power Engineering

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Virtual Instrument for Crimped Connections Temperature and Specific Losses Monitoring During Electrical Tests

American Journal of Energy and Power Engineering
Vol.4 , No. 6, Publication Date: Dec. 13, 2017, Page: 98-104

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Authors

[1]	Constantin Florin Ocoleanu, Electrical Engineering Faculty, University of Craiova, Craiova, Romania.

Abstract

This paper proposes a useful and modern solution for monitoring temperatures and specific losses of crimped connections using a virtual instrument developed in LabVIEW. It is a flexible instrument, which allows user to measure and record values during electrical tests and compare them with references, in order to decide if the tests should continue or not. The proposed solution is very useful not only for the steady state thermal regime but also for transient regime because it can be identified the improper connections before the final electrical machine or equipment assembly. The determination of specific losses implies calculating the initial rate of temperature raise starting from steady state thermal regime equation. A good crimped connection can withstand high levels of temperature and vibration, and it is of paramount importance to detect any failure before final assembly. Therefore, there are two main advantages of using this proposed solution. Firstly, it is a less time-consuming solution for electrical tests in order to detect any improper connections which could affect the electrical machine further operation. Secondly, it is very useful in order to identify those crimped connections that have not been executed correctly before final assembly. In the final part of the paper it was concluded that it will be of significant importance to develop further this virtual instrument in order to provide the user with the possibility of having a graphical representation of the acquired and stored data in real time. It is the case of temperature recorded during electrical tests.

Keywords

Virtual Instrument, Temperature, Crimped Connections, Electrical Tests

Reference

[01]	Standard Guide for Specification and Quality Assurance for the Electrical Contact of Crimped Wire Terminations – B945-05.
[02]	British Standard – BS EN 61238-1: 2003.
[03]	C. F. Ocoleanu, A. I. Dolan, G. Cividjian, S. Teodorescu, “Temperature investigations in two type of crimped connection using experimental determinations,” International Conference on Thermal Engineering, Barcelona, Spain, 2014.
[04]	C. F. Ocoleanu, Gh. Manolea, “Design of a virtual intrument in LabVIEW for crimped connection temperature measurement”, International Conference on Applied and Theoretical Electricity (ICATE’16), pp. 1-4, 2016.
[05]	C. F. Ocoleanu, G, Cividjian, Gh. Manolea, Solutions for Quality Pre-Control of Crimp Contacts Used in Electric Power Systems and Electrical Machines, 3rd International Symposium on Environment-Friendly Energies and Applications, 2014.
[06]	H. Zhang; Y. Yan, "System of wireless temperature and humidity measurement based on LabVIEW", 9th International Conference on Electronic Measurement & Instruments, pp. 483-486, 2009.
[07]	Molex Applications Tooling Group – Quality Crimping Handbook.
[08]	R. Jiming, L. Dun, L. Wenwen, W. Xiaomin,“Multi-Channel Temperature Measurement System based on LabVIEW”, International Journal of Engineering Research & Technology, Volume. 4 - Issue. 11, November, 2015.
[09]	M. Mohd Ruzlin, A. H. Huzainie Shafi, A. G. Ahmad Basri, “Study of cable crimping factors affecting contact resistance of medium voltage cable ferrule and lug”, 22nd International Conference of electricity distribution, Stockholm, Suedia, 2013.
[10]	IEC 60352-2: 2006: Solderless connections – Part 2: Crimped connections – General requirements, test methods and practical guidance, May 2006.
[11]	M. B. Waghmare, Dr. P. N. Chatur, “Temperature and Humidity Analysis using Data Logger of Data Acquisition System: An Approach”, International Journal of Emerging Technology and Advanced Engineering, Volume 2, Issue 1, January 2012.
[12]	Hongqun Zhang; Yuanyuan Yan, "System of wireless temperature and humidity measurement based on LabVIEW", 9th International Conference on Electronic Measurement & Instruments, pp. 483-486, 2009.